METHOD AND APPARATUS OF LASER PROCESS

摘要

Disclosed are a laser processing method comprising a step for providing a bonded panel bonded by interposing an intermediate layer between a first panel and a second panel, a step for inserting a film between the second panel and the intermediate layer to correspond to a processing target location, and a step for cutting a part of the second panel by irradiating a laser; and a laser processing apparatus. The cutting step is performed to prevent damage in the intermediate layer in the laser processing method by controlling a processing depth of a laser to correspond to the thickness of the film. An LCD panel is formed by binding a color filter panel and a TFT panel. The present invention has an effect of preventing damage, which might occur when one panel is selectively cut by using a laser as necessary; and repairing damage even if the damage is occurred.