| 摘要 |
The present invention is to provide a wafer machining method capable of effectively dividing a wafer, in which a device is formed by a functional layer laminated on the surface of a substrate, into individual devices. The wafer machining method divides the wafer, in which a device is formed by a functional layer laminated on the surface of a substrate, along a plurality of streets partitioning the device. The wafer machining method includes a cutting groove forming step of forming a cutting groove by leaving a portion not reaching the functional layer by placing a cutting blade in a region corresponding to the street from the back surface of the substrate; and a laser processing step of breaking a part of the remaining substrate and the functional layer by irradiating laser beam along the bottom of the cutting groove from the back surface of the substrate that went through the cutting groove forming step. |
