| 摘要 |
The present invention relates to a method for cutting a glass substrate, capable of forming a through hole on a glass substrate used as a touch panel by using a laser beam, comprising an irradiating step, a heating step, a cooling step, a contracting step, and a separating step. The glass substrate is divided into a through hole cutting part arranged inside a line to be cut among the glass substrates, and a substrate main body part arranged outside the line to be cut among the glass substrates, by irradiating the line to be cut, of the through hole, with a first laser beam in the irradiating step. The through hole cutting part is heated at a temperature lower than a melting point of the glass substrate by irradiating the through hole cutting part with a second laser beam in the heating step. The through hole cutting part and the substrate main body part are cooled for a fixed time in the cooling step. The through hole cutting part and the substrate main body part are separated from each other as the volume of the through hole cutting part is contracted during the cooling step, in the contracting step. A through hole is formed as the contracted through hole cutting part is separated from the substrate main body part in the separating step. |
