| 摘要 |
The present invention relates to a multi-functional polishing apparatus, and more particularly to a multi-functional polishing apparatus including a polishing unit provided on a horizontal frame of a body frame to polish a polishing object by a rotation of a plurality of polishing pads; a collecting unit to collect dust generated during polishing; a water spraying unit to spray water to the polishing object during the polishing; a manipulating unit to select any one of a dry mode, in which the polishing unit interworks with the collecting unit, and a wet mode, in which the polishing unit interworks with the water spraying unit; and a control unit to control the dry mode or the wet mode selected by a manipulation of the manipulating unit. According to the present invention described above, costs as well as the working time can be saved and work efficiency can be improved because the work can be performed by quickly responding to a work environment since the polishing object can be polished in the dry mode or the wet mode. |
