| 摘要 |
The present invention relates to a method for preparing a printed circuit board, a printed circuit board prepared by the method, and a method for manufacturing a mold for the method for preparing the printed circuit board. Specifically, a pattern printing method using nanoparticle alignment according to the present invention comprises: a first step which forms a thin film on a substrate using a synthetic resin solution; a second step which forms a concave and convex pattern on the thin film; a third step which arranges the nanoparticles along the concave and convex pattern by spraying the surface of the thin film with the nanoparticle solution; and a fourth step which forms a circuit pattern on which the nanoparticles are arranged by sintering the surface of the thin film. According to the present invention: cost competitiveness can be obtained compared to a conventional photolithography; eco-friendly of the process can be possible; the pattern printing method can be applied in plastic substrates by processing a printing process at low temperatures and normal pressures; and materials used for preparing a microfabricated structure has no limitation. In other words, an additional advantage of obtaining a bendable display (generally, flexible display) can be possible through developing a nanoparticle alignment printing process. [Reference numerals] (AA) Start process for manufacturing printed circuit board; (S110) Form thin film on substrate; (S120) Pressurize the thin film using mold; (S130) Harden the thin film as being pressurized; (S140) Modify surface of the thin film; (S150) Spray nanoparticle solution; (S160) Sintering the sprayed nanoparticle solution |
