COMPOSITION FOR NON-CONDUCTIVE FILM AND NON-CONDUCTIVE FILM INCLUDING THE SAME

摘要

The present invention relates to a composition for a non-conductive adhesive film and a non-conductive adhesive film comprising the same. More particularly, the composition for a non-conductive adhesive film and the non-conductive adhesive film comprising the same can minimize voids between bumps caused by tacky at room temperature, ensure reliable bump joint by improving the bump filling property, prevent a wafer delamination by improving a film adhesive force on the wafer, and significantly improve workability due to a high degree of transparency. In addition, the composition for a non-conductive adhesive film and the non-conductive adhesive film comprising the same can be widely used for various semiconductors and electric or electronic products comprising the various semiconductors by having heat resistance required for semiconductor products.