SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

摘要

A semiconductor device includes a first semiconductor chip at least partially overlapping a second semiconductor chip. The first semiconductor chip is coupled to a substrate and has a first width, and the second semiconductor chip has a second width. The device also includes a heat sink coupled to the second semiconductor chip and having a third width different from at least one of the first width or the second width. A package molding section at least partially overlaps a first area of the heat sink and does not overlap a second area of the heat sink which includes a top surface of the heat sink.

主权项

1. A semiconductor device comprising:
a substrate; a first semiconductor chip at least partially overlapping a second semiconductor chip, the first semiconductor chip coupled to the substrate and having a first width, and the second semiconductor chip having a second width; a heat sink coupled to the second semiconductor chip and having a third width different from at least one of the first width or the second width; and a package molding section at least partially overlapping a first area of the heat sink and not overlapping a second area of the heat sink, the second area including a top surface of the heat sink.