| 摘要 |
A method for producing electrical components (408), comprising: - fixing a punched leadframe (102) in a mould (116), wherein the punched leadframe (102) has a plurality of connection areas (106), which are designed for the connection of at least one electronic element (402), and a plurality of connecting structures (108), wherein the connecting structures (108) mechanically connect a plurality of connection areas (106) to one another, - fixing a sealing frame (104) in the mould (116), wherein the sealing frame (104) entirely surrounds the punched leadframe (102), and - applying a moulding composition (400) to the punched leadframe (102) and the sealing frame (104), wherein the moulding composition (400) mechanically connects the punched leadframe (102) and the sealing frame (104). |
