| 摘要 |
The purpose of the present invention is to provide an apparatus and a method of continuously fabricating a solder ball at low costs which simplify a fabrication process and improves yield by a method which controls the size of a liquid drop generated by using the magnitude of voltage and frequency, and generates uniform liquid drops which are smaller than a nozzle pipe by applying AC voltage to a Taylor-cone-type liquid generated by an electric field without applying mechanical vibration to a melting chamber. |
