发明名称 VARIABLE-WAVELENGTH INTERFERENCE FILTER, OPTICAL FILTER DEVICE, OPTICAL MODULE, AND ELECTRONIC APPARATUS
摘要 A variable-wavelength interference filter includes a pair of substrates, a pair of reflection films provided on these substrates, a first electrode, a second electrode, a first conduction electrode provided on the first substrate and provided from the first electrode up to an outer peripheral edge side of the first substrate over the first electrode, a second conduction electrode provided on the second substrate and electrically connected to the first conduction electrode. The first substrate has a first conduction electrode surface facing a contact surface where the first conduction electrode and the second conduction electrode contact each other. The second substrate has a second conduction electrode surface facing the contact surface. A minimum distance from the first conduction electrode surface to the second conduction electrode surface is different from a minimum distance from the first bonding surface to the second bonding surface.
申请公布号 US2014240837(A1) 申请公布日期 2014.08.28
申请号 US201414187942 申请日期 2014.02.24
申请人 Seiko Epson Corporation 发明人 Nishimura Teruyuki
分类号 G02B26/00 主分类号 G02B26/00
代理机构 代理人
主权项 1. A variable-wavelength interference filter comprising: a first substrate; a second substrate facing the first substrate; a first reflection film provided on the first substrate; a second reflection film provided on the second substrate and facing the first reflection film; a first electrode provided on the first substrate; a first conduction electrode provided on the first substrate and provided from the first electrode up to an outer peripheral edge side of the first substrate over the first electrode; a second electrode provided on the second substrate and facing the first electrode; a second conduction electrode provided on the second substrate and electrically connected to the first electrode via the first conduction electrode; and a bonding layer bonding together a first bonding surface of the first substrate and a second bonding surface of the second substrate facing the first bonding surface; wherein the first substrate has a first conduction electrode surface facing a contact surface where the first conduction electrode and the second conduction electrode contact each other, the second substrate has a second conduction electrode surface facing the contact surface, and a minimum distance from the first conduction electrode surface to the second conduction electrode surface is different from a minimum distance from the first bonding surface to the second bonding surface.
地址 Tokyo JP