发明名称 |
VARIABLE-WAVELENGTH INTERFERENCE FILTER, OPTICAL FILTER DEVICE, OPTICAL MODULE, AND ELECTRONIC APPARATUS |
摘要 |
A variable-wavelength interference filter includes a pair of substrates, a pair of reflection films provided on these substrates, a first electrode, a second electrode, a first conduction electrode provided on the first substrate and provided from the first electrode up to an outer peripheral edge side of the first substrate over the first electrode, a second conduction electrode provided on the second substrate and electrically connected to the first conduction electrode. The first substrate has a first conduction electrode surface facing a contact surface where the first conduction electrode and the second conduction electrode contact each other. The second substrate has a second conduction electrode surface facing the contact surface. A minimum distance from the first conduction electrode surface to the second conduction electrode surface is different from a minimum distance from the first bonding surface to the second bonding surface. |
申请公布号 |
US2014240837(A1) |
申请公布日期 |
2014.08.28 |
申请号 |
US201414187942 |
申请日期 |
2014.02.24 |
申请人 |
Seiko Epson Corporation |
发明人 |
Nishimura Teruyuki |
分类号 |
G02B26/00 |
主分类号 |
G02B26/00 |
代理机构 |
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代理人 |
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主权项 |
1. A variable-wavelength interference filter comprising:
a first substrate; a second substrate facing the first substrate; a first reflection film provided on the first substrate; a second reflection film provided on the second substrate and facing the first reflection film; a first electrode provided on the first substrate; a first conduction electrode provided on the first substrate and provided from the first electrode up to an outer peripheral edge side of the first substrate over the first electrode; a second electrode provided on the second substrate and facing the first electrode; a second conduction electrode provided on the second substrate and electrically connected to the first electrode via the first conduction electrode; and a bonding layer bonding together a first bonding surface of the first substrate and a second bonding surface of the second substrate facing the first bonding surface; wherein the first substrate has a first conduction electrode surface facing a contact surface where the first conduction electrode and the second conduction electrode contact each other, the second substrate has a second conduction electrode surface facing the contact surface, and a minimum distance from the first conduction electrode surface to the second conduction electrode surface is different from a minimum distance from the first bonding surface to the second bonding surface. |
地址 |
Tokyo JP |