发明名称 PIEZOELECTRIC DEVICE AND ELECTRONIC APPARATUS
摘要 A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.
申请公布号 US2014239773(A1) 申请公布日期 2014.08.28
申请号 US201414268447 申请日期 2014.05.02
申请人 Seiko Epson Corporation 发明人 HORIE Kyo
分类号 H02N2/00 主分类号 H02N2/00
代理机构 代理人
主权项 1. A piezoelectric device comprising: a piezoelectric vibration element; a temperature sensor that detects temperature; an insulating substrate having: a first surface and a second surface opposite to the first surface;an element mounting pad that is provided on a first part of the first surface, the piezoelectric vibration element being mounted on the element mounting pad;a recess that is provided in the second surface; anda temperature sensor mounting pad that is provided in the recess, the temperature sensor mounting pad being covered by solder, the temperature sensor being mounted on the temperature sensor mounting pad; a metal sealing member that is provided on a second part of the first surface so as to surround the piezoelectric vibration element in a plan view; a metal lid member that seals the piezoelectric vibration element relative to the first surface, the metal lid member being connected to the metal sealing member; a heat transfer metal member that is provided at the insulating substrate, wherein the heat transfer metal member extends from the temperature sensor mounting pad to the metal sealing member on an inner surface of the insulating substrate or through inside of the insulating substrate so as to thermally connect the temperature sensor and the metal lid member.
地址 Tokyo JP