PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF

摘要

A packaging substrate and a fabrication method thereof are disclosed. The packaging substrate includes: a substrate body having a plurality of first and second conductive pads formed on a surface thereof; a first insulating layer formed on the surface of the substrate body and having a plurality of first and second openings for respectively exposing the first and second conductive pads; a conductive layer formed on the first and second conductive pads and the first insulating layer around peripheries of the first and second conductive pads; a plurality of first and second conductive bumps formed on the conductive layer on the first and second conductive pads, respectively; a solder layer formed on the second conductive bumps; and a plurality of conductive posts formed on the first conductive bumps and having a width different from that of the first conductive bumps. The invention improves the fabrication efficiency.

主权项

1. A packaging substrate, comprising:
a substrate body having a first surface with a plurality of first conductive pads and a plurality of second conductive pads and a second surface opposite to the first surface; a first insulating layer formed on the first surface of the substrate body and having a plurality of first openings for exposing the first conductive pads and a plurality of second openings for exposing the second conductive pads; a conductive layer formed on the first conductive pads, the second conductive pads and the first insulating layer around peripheries of the first and second conductive pads; a plurality of first conductive bumps formed on the conductive layer on the first conductive pads and a plurality of second conductive bumps formed on the conductive layer on the second conductive pads; a solder layer formed on the second conductive bumps; and a plurality of conductive posts formed on the first conductive bumps and having a width different from that of the first conductive bumps.