| 发明名称 |
WIRE BONDING ASSEMBLY AND METHOD |
| 摘要 |
A method of wire bonding a die to a lead frame comprising mounting the die on a die attachment pad portion of a leadframe and supporting the leadframe on a support plate having a vacuum hole therein filled with porous material. |
| 申请公布号 |
US2014239473(A1) |
申请公布日期 |
2014.08.28 |
| 申请号 |
US201313781244 |
申请日期 |
2013.02.28 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
Chia MengThee |
| 分类号 |
H01L23/00;H01L23/495 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit (“IC”) package wire bonding assembly comprising:
a leadframe support plate having a vacuum hole, positioned and centered directly under the center portion of a die attachment pad, extending therethrough; and a porous filler material positioned in said vacuum hole, configured to provide vertical support for the center of the die attachment pad structure and substantially eliminating elastic deformation of the die attachment pad and bounce during ball bonding. |
| 地址 |
Dallas TX US |
