SEMICONDUCTOR DEVICE

摘要

A semiconductor device includes a lead frame, a semiconductor chip soldered to the lead frame, and a metal bar. The metal bar is arranged inside a solder layer so as to extend along one side of the semiconductor chip. When viewed in a stacking direction of the lead frame and the semiconductor chip, the metal bar is arranged so that a part of the metal bar overlaps the semiconductor chip, and the rest of the metal bar does not overlap the semiconductor chip. Then, in a section of the metal bar in a plane perpendicular to a longitudinal direction of the metal bar, an outline of the metal bar on a side of a center of the semiconductor chip is curved so as to project on the side of the center of the semiconductor chip.

主权项

1. A semiconductor device comprising:
a lead frame; a semiconductor chip soldered to the lead frame; and a metal bar that extends inside a solder layer along one side of the semiconductor chip and is arranged so that a part of the metal bar overlaps the semiconductor chip and the rest of the metal bar does not overlap the semiconductor chip when viewed in a stacking direction of the lead frame and the semiconductor chip, wherein in a section of the metal bar in a plane that is perpendicular to a longitudinal direction of the metal bar, an outline of the metal bar on a side of a center of the semiconductor chip is curved so as to project on the side of the center of the semiconductor chip, the outline of the metal bar extending from an end portion of the metal bar on the semiconductor chip side to an end portion of the metal bar on the lead frame side.