Method of Bonding Semiconductor Elements and Junction Structure

摘要

[Problem] The present invention provides a method for bonding semiconductor elements while assuring excellent electric conductivity and transparency at an interface, and a junction structure according to the bonding method. The present invention also provides a method for bonding semiconductor elements wherein excellent electric conductivity is assured at an interface and optical characteristics favorable for element characteristics can be designed, and a junction structure according to the bonding method.;[Solution] Electrically conductive nano particles which are not covered with organic molecules are arrayed on a surface of one semiconductor element without causing optical loss, and another semiconductor element is pressure-bonded thereagainst.

主权项

1. A method of bonding semiconductor elements, comprising: arraying electrically conductive nano particles not covered with organic molecules on a surface of one semiconductor element, and pressure-bonding another semiconductor element thereagainst.