SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, IMAGE PICKUP ELEMENT AND IMAGE PICKUP DEVICE

摘要

PROBLEM TO BE SOLVED: To make it possible to inhibit damages on a semiconductor substrate by application of pressure at the time of junction and successfully maintain a deformation shape and a connection state at the time of junction.SOLUTION: A semiconductor substrate comprises: a substrate body 12d on which a wiring part 16 is formed; and a junction electrode 12a provided on a second surface 12c of the substrate body 12d in a projected manner. The junction electrode 12a includes a composite having: a first metal part 14 which is provided to project from the second surface 12c of the substrate body 12d and has a base end part in a projection direction electrically connected with the wiring part 16; and a second metal part 15 which is composed of a second metal harder than a first metal composing the first metal part 14 and provided in a range of less than a projection height of the first metal part 14 to form a joint with the first metal part 14.