| 摘要 |
PROBLEM TO BE SOLVED: To reduce the thickness of a resin multilayer substrate with a built-in component.SOLUTION: A resin multilayer substrate 2 is formed by laminating a plurality of resin layers 21 and has a main surface 4. Wiring 8 including a conductor pattern 7 and a via conductor 6 is formed inside the resin multilayer substrate 2, and a plurality of cavities are formed on the main surface 4. A composite substrate 3 includes a core substrate 31 and a plurality of components 32. The core substrate 31 has a facing surface which faces the resin multilayer substrate 2. The plurality of components 32 are mounted on the facing surface side of the core substrate 31. The plurality of components 32 are individually stored in the cavities. A connection terminal 9 electrically connects the wiring 8 and the core substrate 31. |
