| 摘要 |
PROBLEM TO BE SOLVED: To provide a developer for a polyimide precursor, which can increase a development margin, less likely reduces the film thickness of a polyimide resin in a developing process and has high safeness, and to provide a developing method of a photosensitive polyimide resin composition using the developer, and a pattern forming method using the developing method.SOLUTION: The developer for a polyimide precursor comprises: (a) N,N,N',N'-tetramethyl urea; and (b) a lower alcohol having 1 to 5 carbon atoms. The developing method of a photosensitive polyimide resin composition includes a step of developing a photosensitive polyimide precursor resin composition that is at least partially exposed, with the above developer for a polyimide precursor. The pattern forming method includes: a forming step of forming a coating film or a molded article comprising a photosensitive polyimide precursor composition; an exposure step of selectively exposing the coating film or the molded article; and a developing step of developing the coating film or the molded article after exposure by the above developing method. |
