BONDING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To provide a bonding method of bonding electrodes with each other so that a paste-like bonding agent including metal particles is not forced out sideways from electrodes by using the bonding agent, in a three-dimensional packaging semiconductor module in which a module substrate is bonded on both surfaces of a semiconductor chip.SOLUTION: A bonding method includes the following steps of: applying a paste-like bonding agent A including metal particles onto electrodes 20 and 21 of a semiconductor chip 10 and an electrode 30 of a module substrate 11, respectively; forming unevenness on a surface of the bonding agent A of the electrode 30 of the module substrate 11; curing the bonding agent A in a state that there is unevenness on its surface; combining the bonding agent A cured in a state that there is unevenness on the surface of the electrode 30 of the module substrate 11 with an uncured bonding agent A of the electrodes 20 and 21 of the semiconductor chip 10; and sintering the metal particles of the combined bonding agent A.