METHOD OF GRINDING A SUBSTRATE AND METHOD OF MANUFACTURING A SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE SAME

摘要

Provided is a method for grinding a substrate which comprises the steps of: preparing a substrate including a first main surface having a semiconductor layer thereon and a second main surface which is opposite to the first main surface; attaching a support film to the first main surface using a glue; curing the glue by applying energy to the glue; grinding the second main surface of the substrate to reduce the thickness of the substrate; and removing the support film from the first main surface by applying a force to the support film in a non-traverse direction.