| 摘要 |
The present invention relates to an electrode roller apparatus for copper plating. The electrode roller apparatus includes a positive electrode roller which applies positive electricity to the film, printed with a conductive ink, and is arranged inside a plating bath; and a negative roller part which is arranged to be separated from the positive electrode and contacts the film, and proceeds a copper plating process by reducing ions. The negative roller part includes a negative roller which contacts the film; and a cleaning part which is located in the direction where the negative roller and the film do not contact each other, and sprays cleaning water on the surface of the negative roller to wash the negative roller contaminated due to contacting the film. |
