发明名称 METHODS FOR IMPROVING ADHESION OF ALUMINUM FILMS
摘要 <p>The described embodiments relate generally to aluminum films and pretreatments for improving the adhesion of aluminum films on substrate surfaces. Methods involve providing three-dimensional adhesion surfaces on the substrate that promote adhesion to a subsequently deposited aluminum film. The methods can avoid the use of strike materials, such as nickel and copper, used in conventional adhesion-promoting treatments. According to some embodiments, methods involve providing an aluminum oxide adhesion layer on the substrate prior to depositing aluminum. According to some embodiments, methods involve providing a zincating layer on the substrate prior to depositing aluminum. According some embodiments, methods involve roughening the surface of the substrate prior to depositing aluminum. Some embodiments involve a combination of two or more substrate pretreatments. Described methods can be used to provide more flexibility in subsequent anodizing processes. In some embodiments, methods involve anodizing the aluminum film and a portion of the substrate.</p>
申请公布号 WO2014130453(A1) 申请公布日期 2014.08.28
申请号 WO2014US16913 申请日期 2014.02.18
申请人 ALUMIPLATE, INC. 发明人 BROWNING, LUCY, ELIZABETH;CARLSON, WILLIAM, CHARLES;SCHULZ, JON, FREDERICK;VALLEJO, GUSTAVO, ROLANDO
分类号 C25D11/04;C25D11/18 主分类号 C25D11/04
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