发明名称 |
METHODS FOR IMPROVING ADHESION OF ALUMINUM FILMS |
摘要 |
<p>The described embodiments relate generally to aluminum films and pretreatments for improving the adhesion of aluminum films on substrate surfaces. Methods involve providing three-dimensional adhesion surfaces on the substrate that promote adhesion to a subsequently deposited aluminum film. The methods can avoid the use of strike materials, such as nickel and copper, used in conventional adhesion-promoting treatments. According to some embodiments, methods involve providing an aluminum oxide adhesion layer on the substrate prior to depositing aluminum. According to some embodiments, methods involve providing a zincating layer on the substrate prior to depositing aluminum. According some embodiments, methods involve roughening the surface of the substrate prior to depositing aluminum. Some embodiments involve a combination of two or more substrate pretreatments. Described methods can be used to provide more flexibility in subsequent anodizing processes. In some embodiments, methods involve anodizing the aluminum film and a portion of the substrate.</p> |
申请公布号 |
WO2014130453(A1) |
申请公布日期 |
2014.08.28 |
申请号 |
WO2014US16913 |
申请日期 |
2014.02.18 |
申请人 |
ALUMIPLATE, INC. |
发明人 |
BROWNING, LUCY, ELIZABETH;CARLSON, WILLIAM, CHARLES;SCHULZ, JON, FREDERICK;VALLEJO, GUSTAVO, ROLANDO |
分类号 |
C25D11/04;C25D11/18 |
主分类号 |
C25D11/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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