PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES

摘要

PROBLEM TO BE SOLVED: To provide a package for high-power semiconductor devices.SOLUTION: Methods 200 and apparatuses for forming a package for high-power semiconductor devices are disclosed herein. The methods 200 comprise: providing 204 a first thermal spreader layer on a semiconductor material; providing 208 a second thermal spreader layer on a metal carrier; providing 212 an adhesive on the first thermal spreader layer or the second thermal spreader layer; and coupling 216 the first thermal spreader layer with the second thermal spreader layer after the step of providing the adhesive.