On-Die Programming of Integrated Circuit Bond Pads

摘要

SoC and SiP designs are configured with an antifuse link within the die to allow on-die programming of bond wires connecting package lead fingers to the bond pads on the die. This permits alteration of the bond pad connections for the die, particularly for the ground voltage ground signal (VSS) connections on the bond pad, at the testing stage after the die package and the power supply have been installed on the PCB. On-die programming of antifuse link allows the VSS bond pad connections to be reconfigured, typically to eliminate long bond wire runs to reduce ground bounce and simultaneous switching output (SSO) noise, after assembly and field testing of the integrated circuit. Antifuse programming is completed by applying the programming voltage to the programming pad of the antifuse.

主权项

1. An integrated circuit comprising a programmable antifuse link, comprising:
a printed circuit board; an integrated circuit die and a package comprising a power supply carried by the printed circuit board; the package having first and second power supply lead fingers; the die comprising first and second power supply bond pads configured for connection to respective first and second power supply lead fingers on the package; a first bond wire connecting the first power supply lead finger of the package to the first bond pad of the die; antifuse links located within the die selectively connecting the first and second power supply bond pads for electrically connecting the first and second power supply bond pads together.