发明名称 LASER MACHINING APPARATUS
摘要 A laser machining apparatus includes a laser nozzle for supplying an assistive gas to remove undesirable materials and applying a laser beam at an angle, which is inclined with respect to a surface of a workpiece, a sputter blocking jig disposed over a region of the workpiece that is irradiated with the laser beam, so as to lie across directions in which the laser beam is scattered, and for blocking sputtered particles that are generated from the surface by the applied laser beam, and a joint connecting the laser nozzle and the sputter blocking jig to each other. The joint moves the laser nozzle and the sputter blocking jig in synchronism with each other.
申请公布号 US2014238961(A1) 申请公布日期 2014.08.28
申请号 US201414188787 申请日期 2014.02.25
申请人 Honda Motor Co., Ltd. 发明人 Kato Daisuke
分类号 B23K26/38;B23K26/14 主分类号 B23K26/38
代理机构 代理人
主权项 1. A laser machining apparatus, which applies a laser beam to a workpiece at an angle that is set to be inclined with respect to a surface of the workpiece, to thereby form an oblique hole in the surface, comprising: a laser nozzle for supplying an assistive gas to remove undesirable material produced by the applied laser beam, and applying the laser beam at the set angle with respect to the surface of the workpiece, either in a pulsed pattern or continuously for a predetermined period of time; a sputter blocking jig disposed over a region of the workpiece that is irradiated with the laser beam, so as to lie across directions in which the laser beam is scattered, and for blocking sputtered particles that are generated from the surface by the applied laser beam; and a joint interconnecting the laser nozzle and the sputter blocking jig, the joint moving the laser nozzle and the sputter blocking jig in synchronism with each other.
地址 Tokyo JP