发明名称 |
PACKAGING COMPATIBLE WAFER LEVEL CAPPING OF MEMS DEVICES |
摘要 |
<p>This invention discloses and claims a cost-effective, wafer-level package process for microelectromechanical devices (MEMS). Specifically, the movable part of MEMS device is encapsulated and protected while in wafer form so that commodity, lead-frame packaging can be used. An overcoat polymer, such as, epoxycyclohexyl polyhedral oligomeric silsesquioxanes (EPOSS) has been used as a mask material to pattern the sacrificial polymer as well as overcoat the air-cavity. The resulting air-cavities are clean, debris-free, and robust. The cavities have substantial strength to withstand molding pressures during lead-frame packaging of the MEMS devices. A wide range of cavities from 20μm×400μm to 300μm×400μm have been fabricated and shown to be mechanically stable. These could potentially house MEMS devices over a wide range of sizes. The strength of the cavities has been investigated using nano-indentation and modeled using analytical and finite element techniques. Capacitive resonators packaged using this protocol have shown clean sensing electrodes and good functionality.</p> |
申请公布号 |
SG11201402261S(A) |
申请公布日期 |
2014.08.28 |
申请号 |
SG11201402261S |
申请日期 |
2012.12.06 |
申请人 |
GEORGIA TECH RESEARCH CORPORATION;KOHL, PAUL, A.;SAHA, RAJARSHI;FRITZ, NATHAN |
发明人 |
KOHL, PAUL, A.;SAHA, RAJARSHI;FRITZ, NATHAN |
分类号 |
B81C1/00 |
主分类号 |
B81C1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|