| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element such as an LED element which prevents detachment and cracks of a protective layer to achieve excellent reliability; and provide a manufacturing method of the semiconductor element.SOLUTION: A semiconductor element comprises: a first junction layer 13 formed on a substrate 11; a second junction layer 15 formed in a central region on a top surface of the first junction layer; a semiconductor structure layer 19 formed on the second junction layer; an adhesion layer 31 formed on an outer region outside the central region on the top surface of the first junction layer; and an insulating protective layer 29 which covers lateral faces of the semiconductor structure layer and the second junction layer to reach on the adhesion layer. |
