WIRING BOARD AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board which is excellent in heat radiation performance.SOLUTION: A wiring board 1 includes: an insulation substrate 11 having a main surface including a mounting region 11a of an electronic component 2; and a heat transfer member 12 provided in the insulation substrate 11. The transfer member 12 includes: a first heat transfer part 12a which is provided at a position overlapping with the mounting region 11a in a plane view and has an upper surface and a lower surface having an area smaller than the upper surface; and a second heat transfer part 12b which is provided at an area ranging from the first heat transfer part 12a to a side surface of the insulation substrate 11 and is exposed from the side surface of the insulation substrate 11.