发明名称 NONPLANAR DEVICE WITH THINNED LOWER BODY PORTION AND METHOD OF FABRICATION
摘要 A nonplanar semiconductor device having a semiconductor body formed on an insulating layer of a substrate. The semiconductor body has a top surface opposite a bottom surface formed on the insulating layer and a pair of laterally opposite sidewalls wherein the distance between the laterally opposite sidewalls at the top surface is greater than at the bottom surface. A gate dielectric layer is formed on the top surface of the semiconductor body and on the sidewalls of the semiconductor body. A gate electrode is formed on the gate dielectric layer on the top surface and sidewalls of the semiconductor body. A pair of source/drain regions are formed in the semiconductor body on opposite sides of the gate electrode.
申请公布号 US2014239358(A1) 申请公布日期 2014.08.28
申请号 US201414273373 申请日期 2014.05.08
申请人 Shah Uday;Doyle Brian S.;Brask Justin K.;Chau Robert S.;Letson Thomas A. 发明人 Shah Uday;Doyle Brian S.;Brask Justin K.;Chau Robert S.;Letson Thomas A.
分类号 H01L29/78 主分类号 H01L29/78
代理机构 代理人
主权项 1. A nonplanar tri-gate transistor comprising: a semiconductor body having: a top surface opposite a bottom surface; anda pair of laterally opposite sidewalls extending between the top surface and the bottom surface, wherein the laterally opposite sidewalls include a tapered portion that extends from the top surface to the bottom surface of the semiconductor body such that a distance between the laterally opposite sidewalls at the top surface is greater than a distance between the laterally opposite sidewalls at the bottom surface; a gate dielectric layer formed on and in direct contact with the top surface and the sidewalls of the semiconductor body from the top surface to the bottom surface; a gate electrode formed on the gate dielectric layer on the top surface and sidewalls of the semiconductor body; and a pair of source/drain region formed in the semiconductor body on opposite sides of the gate electrode.
地址 Portland OR US