Power semiconductor device has press ring that is provided for respectively pressing surfaces of cooling plate and cooling portion facing side surfaces of seal ring against respective surfaces of cooling plate and cooling portion

摘要

The device (1) has a metallic seal ring (22) that is arranged in a gap formed in a cooling plate (5), for sealing a surface (24) of cooling plate against a surface (26) of cooling portion (2) in liquid tight manner. The seal ring is arranged at the side of power semiconductor component facing a groove (28). A press ring (23) is arranged toward a bottom of narrowing-shaped groove. The press ring is provided for respectively pressing surfaces of the cooling plate and cooling portion facing side surfaces of the seal ring against respective surfaces of cooling plate and cooling portion.