发明名称 THREE DIMENSIONAL NON-VOLATILE STORAGE WITH ASYMMETRICAL VERTICAL SELECT DEVICES
摘要 A three-dimensional array adapted for memory elements that reversibly change a level of electrical conductance in response to a voltage difference being applied across them. Memory elements are formed across a plurality of planes positioned different distances above a semiconductor substrate. Bit lines to which the memory elements of all planes are connected are oriented vertically from the substrate and through the plurality of planes.
申请公布号 US2014242764(A1) 申请公布日期 2014.08.28
申请号 US201414269107 申请日期 2014.05.03
申请人 SANDISK 3D LLC 发明人 Scheuerlein Roy E.
分类号 H01L27/24 主分类号 H01L27/24
代理机构 代理人
主权项 1. A method of fabricating non-volatile storage, comprising: adding one or more devices and signal lines on top of a substrate; adding a select layer above the one or more devices and signal lines, the adding the select layer includes adding select lines and adding asymmetrical vertically oriented select devices; and adding a monolithic three dimensional array above the select layer, the monolithic three dimensional array includes word lines and vertically oriented bit lines connected to memory elements; the vertically oriented select devices are connected to the vertically oriented bit lines, the select lines and global bit lines.
地址 Milpitas CA US