COOLING DEVICE FOR SEMICONDUCTOR MODULE, AND SEMICONDUCTOR MODULE

摘要

A cooling device for a semiconductor module supplying a coolant from outside into a water jacket and cooling a semiconductor element, includes a heat sink thermally connected to the semiconductor element; a first flow channel extending from a coolant introducing port and including a guide section having an inclined surface for guiding the coolant toward one side surface of the heat sink; a second flow channel disposed parallel to the first flow channel and extending toward a coolant discharge port; a flow velocity adjusting plate disposed in the second flow channel and formed parallel to the other side surface of the heat sink at a distance therefrom; and a third flow channel formed to communicate the first flow channel and the second flow channel. The heat sink is disposed in the third flow channel.

主权项

1. A cooling device, comprising:
a water jacket to which a coolant is adapted to be supplied from outside for cooling a semiconductor element disposed outside the water jacket; a heat sink thermally connected to the semiconductor element; a first flow channel disposed inside the water jacket and extending from a coolant introducing port, the first flow including a guide section having an inclined surface for guiding the coolant toward one side surface of the heat sink; a second flow channel disposed inside the water jacket parallel to the first flow channel at a distance therefrom and extending toward a coolant discharge port, the second flow channel being formed with a sidewall parallel to the other side surface of the heat sink; a flow velocity adjusting plate disposed in the second flow channel and formed parallel to the other side surface of the heat sink at a distance therefrom; and a third flow channel formed at a position communicating the first flow channel and the second flow channel inside the water jacket, wherein the heat sink is disposed in the third flow channel.