| 发明名称 |
CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT |
| 摘要 |
In various embodiments a chip arrangement is provided, wherein the chip arrangement may include a chip and at least one foil attached to at least one side of the chip. |
| 申请公布号 |
US2014239474(A1) |
申请公布日期 |
2014.08.28 |
| 申请号 |
US201313779832 |
申请日期 |
2013.02.28 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
Pueschner Frank;Hoegerl Juergen;Hollweck Roman;Scherl Peter |
| 分类号 |
H01L23/00;H01L21/50 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip arrangement, comprising:
a chip; and a foil attached directly to one of the front side of the chip and the back side of the chip, wherein the chip comprises at least one contact pad and wherein the foil comprises at least one opening to expose the at least one contact pad. |
| 地址 |
Neubiberg DE |
