| 发明名称 |
SEMICONDUCTOR PACKAGE |
| 摘要 |
According to example embodiments, a semiconductor package may include a first package substrate, a first semiconductor chip on the first package substrate, and a thermistor array film on the first semiconductor chip. The thermistor array film may include a variable resistive film that covers the first semiconductor chip, and an array of electrode patterns that are connected to the variable resistive film. The array of electrode patterns may be connected to at least one of the upper and lower surfaces of the variable resistive film. |
| 申请公布号 |
US2014239434(A1) |
申请公布日期 |
2014.08.28 |
| 申请号 |
US201314134580 |
申请日期 |
2013.12.19 |
| 申请人 |
KIM Jae Choon;BAE Jin-Kwon;JUNG Eunho |
发明人 |
KIM Jae Choon;BAE Jin-Kwon;JUNG Eunho |
| 分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
a first package substrate; a first semiconductor chip on the first package substrate; and a thermistor array film on the first semiconductor chip, the thermistor array film including a variable resistive film that covers the first semiconductor chip, and an array of electrode patterns that are connected to at least one of an upper surface and an lower surface of the variable resistive film. |
| 地址 |
Incheon KR |
