| 发明名称 |
SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE |
| 摘要 |
There is provided a solid-state image sensor including a semiconductor substrate in which a plurality of pixels are arranged, and a wiring layer stacked on the semiconductor substrate and formed in such a manner that a plurality of conductor layers having a plurality of wirings are buried in an insulation film. In the wiring layer, wirings connected to the pixels are formed of two conductor layers. |
| 申请公布号 |
US2014239433(A1) |
申请公布日期 |
2014.08.28 |
| 申请号 |
US201214346616 |
申请日期 |
2012.09.27 |
| 申请人 |
Sony Corporation |
发明人 |
Wakano Toshifumi |
| 分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A solid-state image sensor comprising:
a semiconductor substrate in which a plurality of pixels are arranged; and a wiring layer stacked on the semiconductor substrate and formed in such a manner that a plurality of conductor layers having a plurality of wirings are buried in an insulation film, wherein, in the wiring layer, wirings connected to the pixels are formed of two conductor layers. |
| 地址 |
Tokyo JP |
