发明名称 CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
摘要 According to various embodiments, a chip arrangement may be provided, the chip arrangement including: a chip; an antenna structure disposed over a first side of the chip, wherein the antenna structure may include an antenna being electrically conductively coupled to the chip; and a reinforcement structure, wherein the reinforcement structure supports the chip to increase the stability of the chip arrangement.
申请公布号 US2014239428(A1) 申请公布日期 2014.08.28
申请号 US201313779828 申请日期 2013.02.28
申请人 INFINEON TECHNOLOGIES AG 发明人 Pueschner Frank;Hoegerl Juergen;Stampka Peter
分类号 H01L31/02;H01L31/18 主分类号 H01L31/02
代理机构 代理人
主权项 1. A chip arrangement, comprising: a chip; an antenna structure disposed over a first side of the chip, the antenna structure comprising: a carrier to which the chip is attached;an antenna being electrically conductively coupled to the chip; anda reinforcement structure supporting the chip to increase the stiffness of the chip arrangement.
地址 Neubiberg DE