发明名称 |
CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT |
摘要 |
According to various embodiments, a chip arrangement may be provided, the chip arrangement including: a chip; an antenna structure disposed over a first side of the chip, wherein the antenna structure may include an antenna being electrically conductively coupled to the chip; and a reinforcement structure, wherein the reinforcement structure supports the chip to increase the stability of the chip arrangement. |
申请公布号 |
US2014239428(A1) |
申请公布日期 |
2014.08.28 |
申请号 |
US201313779828 |
申请日期 |
2013.02.28 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
Pueschner Frank;Hoegerl Juergen;Stampka Peter |
分类号 |
H01L31/02;H01L31/18 |
主分类号 |
H01L31/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A chip arrangement, comprising:
a chip; an antenna structure disposed over a first side of the chip, the antenna structure comprising:
a carrier to which the chip is attached;an antenna being electrically conductively coupled to the chip; anda reinforcement structure supporting the chip to increase the stiffness of the chip arrangement. |
地址 |
Neubiberg DE |