| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device includes a semiconductor chip having a first main surface, a second main surface opposite to the first main surface, a side surface arranged between the first main surface and the second main surface, and a magnetic storage device, a first magnetic shield overlaying on the first main surface, a second magnetic shield overlaying on the second main surface, and a third magnetic shield overlaying on the side surface. The first and second magnetic shields are mechanically connected via the third magnetic shield. |
| 申请公布号 |
US2014239425(A1) |
申请公布日期 |
2014.08.28 |
| 申请号 |
US201414273177 |
申请日期 |
2014.05.08 |
| 申请人 |
RENESAS ELECTRONICS CORPORATION |
发明人 |
WATANABE TAKAHITO;YAMAMICHI SHINTARO;USHIYAMA YOSHITAKA |
| 分类号 |
H01L23/58;H01L27/22 |
主分类号 |
H01L23/58 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a semiconductor chip having a first main surface, a second main surface opposite to the first main surface, and a side surface arranged between the first main surface and the second main surface, the semiconductor chip including a magnetic storage device, a first magnetic shield overlaying on the first main surface; a second magnetic shield overlaying on the second main surface; and
a third magnetic shield overlaying on the side surface,wherein the first and second magnetic shields are mechanically connected via the third magnetic shield. |
| 地址 |
Kawasaki-shi JP |
