发明名称 |
TOUCH PANEL AND MANUFACTURING METHOD THEREOF |
摘要 |
The present invention provides a method for forming a touch panel, at least comprising the following steps. Step S1: a patterned first electrode layer is formed on a cover lens. A display region and a non-display region are defined on the cover lens, and the patterned first electrode layer is formed within the display region; step S2: a shielding layer is formed on the cover lens and disposed within the non-display region; step S3: an insulating layer is then formed on the shielding layer and on the patterned first electrode layer, a plurality of via holes are formed on the insulating layer, thereby exposing parts of the patterned first electrode layer; and step S4: a patterned second electrode layer is formed on the insulating layer within the non-display region, and the patterned second electrode layer is electrically connected to the patterned first electrode layer through the via holes. |
申请公布号 |
US2014240620(A1) |
申请公布日期 |
2014.08.28 |
申请号 |
US201414191453 |
申请日期 |
2014.02.27 |
申请人 |
TPK Touch Solutions (Xiamen) Inc. |
发明人 |
Chiu Tsung-Ke;Su Shunqing;Zhang Zhuanyuan;Lin Yan |
分类号 |
G06F1/16 |
主分类号 |
G06F1/16 |
代理机构 |
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代理人 |
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主权项 |
1. A method for forming a touch panel, at least comprising the following steps:
S1: forming a patterned first electrode layer on a cover lens, defining a display region and a non-display region, surrounding the display region, on the cover lens, wherein the patterned first electrode layer is formed within the display region; S2: forming a shielding layer on the cover lens, wherein the shielding layer is disposed within the non-display region; S3: forming an insulating layer on the shielding layer and on the patterned first electrode layer, forming a plurality of via holes on the insulating layer, exposing parts of the patterned first electrode layer; and S4: forming a patterned second electrode layer on the insulating layer within the non-display region, wherein the patterned second electrode layer is electrically connected to the patterned first electrode layer through the via holes. |
地址 |
Xiamen CN |