ELECTROLESS PLATED MATERIAL FORMED DIRECTLY ON METAL

摘要

A method for forming magnetic conductors includes forming a metal structure on a substrate. Plating surfaces are prepared on the metal structure for electroless plating by at least one of: masking surfaces of the metal structure to prevent electroless plating on masked surfaces and/or activating a surface of the metal structure. Magnetic material is electrolessly plated directly on the plating surfaces to form a metal and magnetic material structure.

主权项

1. An on-chip magnetic device, comprising:
a metal shape including one or more plating surfaces, the plating surfaces being configured to permit electroless material growth directly thereon; and a magnetic structure including an electrolessly plated magnetic material formed directly on the metal shape on the plating surfaces to form a metal and magnetic material inductive structure.