| 摘要 |
Disclosed are a pre-wetting apparatus and method for cleaning solid contaminants from a substrate prior to through resist deposition of metal. In some embodiments, the pre-wetting apparatus includes a process chamber having a substrate holder, and at least one nozzle located directly above the wafer substrate and configured to deliver pre-wetting liquid (for example, degassed deionized water) onto the substrate at a grazing angle of between about 5-45 degrees. In some embodiments, the nozzle is a fan nozzle configured to deliver the liquid to the center of the substrate, such that the liquid first impacts the substrate in the vicinity of the center and then flows over the center of the substrate. In some embodiments, the substrate is rotated unidirectionally or bidirectionally during pre-wetting with multiple accelerations and decelerations, thereby, facilitating the removal of contaminants. |
