发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF FORMING OPENINGS THROUGHINSULATING LAYER OVER ENCAPSULANT FOR ENHANCED ADHESION OFINTERCONNECT STRUCTURE |
摘要 |
A semiconductor device has a semiconductor die mounted to a carrier. An encapsulant is deposited over the semiconductor die and carrier. The carrier is removed. A first insulating layer is formed over a portion of the encapsulant within an interconnect site outside a footprint of the semiconductor die. An opening is formed through the first insulating layer within the interconnect site to expose the encapsulant. The opening can be ring-shaped or vias around the interconnect site and within a central region of the interconnect site to expose the encapsulant. A first conductive layer is formed over the first insulating layer to follow a contour of the first insulating layer. A second conductive layer is formed over the first conductive layer and exposed encapsulant. A second insulating layer is formed over the second conductive layer. A bump is formed over the second conductive layer in the interconnect site. |
申请公布号 |
SG10201402302P(A) |
申请公布日期 |
2014.08.28 |
申请号 |
SG10201402302P |
申请日期 |
2011.11.15 |
申请人 |
STATS CHIPPAC LTD |
发明人 |
YAOJIAN LIN;KANG CHEN;JIANMIN FANG |
分类号 |
|
主分类号 |
|
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|