| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film curable resin composition excellent in resin flowability (implantation property), low in not only arithmetic average roughness of an insulator layer surface in a wet type roughening process but also square root-mean-square roughness, capable of forming a plated conductor layer having enough peel strength, and low in linear thermal expansion coefficient.SOLUTION: There is provided a curable resin composition containing (1) an epoxy resin mixture containing (1-A) an epoxy resin A having two or more kinds of structures selected from among a biphenyl structure, a bixylenol structure, a bisphenol acetophenone structure and a bisphenol fluorene structure, (1-B) an epoxy resin B other than the epoxy resin A, and having a content of the epoxy resin A of 3 to 30 mass% based on 100 mass% of the epoxy resin mixture, and an epoxy equivalent of the epoxy resin A of 1500 to 4800, and (2) a curing agent and (3) an inorganic filler. |
