Multi-Die Package with Separate Inter-Die Interconnects

摘要

A first electrode at a first side of a first semiconductor die is connected to a first conductive region of a substrate. A first electrode at a first side of a second semiconductor die is connected to a second conductive region of the substrate. Each die has a second electrode at an opposing second side of the respective die. A first metal layer extends from a periphery region of the substrate to over the first die. The first metal layer has a generally rectangular cross-sectional area and connects one of the conductive regions in the periphery region of the substrate to the second electrode of the first die. A second metal layer separate from the first metal layer extends over the first and second dies. The second metal layer has a generally rectangular cross-sectional area and connects the second electrodes of the first and second dies.

主权项

1. A multi-die package, comprising:
a substrate having a plurality of conductive regions; a first semiconductor die having first and second opposing sides, a first electrode at the first side connected to a first one of the conductive regions, and a second electrode at the second side; a second semiconductor die having first and second opposing sides, a first electrode at the first side connected to a second one of the conductive regions, and a second electrode at the second side; a first metal layer extending from a periphery region of the substrate to over the first die, the first metal layer having a generally rectangular cross-sectional area and connecting one of the conductive regions in the periphery region of the substrate to the second electrode of the first die; and a second metal layer separate from the first metal layer and extending over the first and second dies, the second metal layer having a generally rectangular cross-sectional area and connecting the second electrode of the first die to the second electrode of the second die.