发明名称 HETEROGENEOUS THERMAL INTERFACE
摘要 An electronic apparatus, such as a lighting fixture, includes a substrate, an electronic device such as a chip-on-board light emitting diode and a thermal interface located between the substrate and the electronic device. The thermal interface includes at least two distinct materials, including a dielectric material and a thermally conductive material. The dielectric material includes a cutout into which the thermally conductive material is located. The dielectric material can completely surround the perimeter of the electronic device or can be located proximate portions of the electronic device that are prone to arcing in order to protect the substrate from arcing. The electronic apparatus operates at a reduced temperature as compared to an electronic apparatus that does not include the thermal interface. Methods for making an electronic apparatus having a thermal interface with a discrete dielectric material and thermally conductive material are also described.
申请公布号 US2014240929(A1) 申请公布日期 2014.08.28
申请号 US201414189587 申请日期 2014.02.25
申请人 ABL IP Holding LLC 发明人 Klein Stephen
分类号 H05K1/02;H05K3/30 主分类号 H05K1/02
代理机构 代理人
主权项 1. An electronic apparatus comprising: a substrate; an electronic device; and a thermal interface located between the substrate and the electronic device, the thermal interface comprising at least two distinct materials, the at least two distinct materials comprising a dielectric material and a thermally conductive material, wherein the dielectric material comprises a cutout into which the thermally conductive material is located.
地址 Conyers GA US