| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board including a via and capable of coping with miniaturization.SOLUTION: A method for manufacturing a wiring board comprises the steps of: forming a via hole in an insulating layer; forming a via conductor in the via hole; forming a catalyst layer on the insulating film; forming a desired pattern mask on the catalyst layer; forming a conductor layer on the catalyst layer by electroless plating; peeling the mask; and removing a catalyst layer in the portion exposed as a result of peeling the mask. |
