发明名称 |
SUBSTRATE FOR SUSPENSION, SUSPENSION, SUSPENSION WITH ELEMENT, AND HARD DISK DRIVE |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for suspension with improved design flexibility of a wiring layer.SOLUTION: A substrate for suspension comprises: a metal support substrate; an insulator layer; and a wiring layer,which are laminated in this order. The wiring layer includes a terminal part connected to an element or an external circuit board. The terminal part has a via part-containing terminal part that contains a via part penetrating through the insulator layer and connected to the metal support substrate in planar view. The via part-containing terminal part is connected to another wiring layer through a first metal support part, a jumper part, a second metal support part, and a second via part. |
申请公布号 |
JP2014157640(A) |
申请公布日期 |
2014.08.28 |
申请号 |
JP20130026594 |
申请日期 |
2013.02.14 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
ONUKI MASAO;OCHI KAZUNORI |
分类号 |
G11B5/60;G11B21/21;H05K1/05 |
主分类号 |
G11B5/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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