发明名称 SUBSTRATE FOR SUSPENSION, SUSPENSION, SUSPENSION WITH ELEMENT, AND HARD DISK DRIVE
摘要 PROBLEM TO BE SOLVED: To provide a substrate for suspension with improved design flexibility of a wiring layer.SOLUTION: A substrate for suspension comprises: a metal support substrate; an insulator layer; and a wiring layer,which are laminated in this order. The wiring layer includes a terminal part connected to an element or an external circuit board. The terminal part has a via part-containing terminal part that contains a via part penetrating through the insulator layer and connected to the metal support substrate in planar view. The via part-containing terminal part is connected to another wiring layer through a first metal support part, a jumper part, a second metal support part, and a second via part.
申请公布号 JP2014157640(A) 申请公布日期 2014.08.28
申请号 JP20130026594 申请日期 2013.02.14
申请人 DAINIPPON PRINTING CO LTD 发明人 ONUKI MASAO;OCHI KAZUNORI
分类号 G11B5/60;G11B21/21;H05K1/05 主分类号 G11B5/60
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