发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device that allows efficiently achieving high breakdown voltage, reduction in a leakage current, and suppression of a current collapse.SOLUTION: A semiconductor device includes: a first semiconductor layer formed on a substrate and composed of a nitride semiconductor; a second semiconductor layer formed on a surface of the first semiconductor layer and composed of a nitride semiconductor having a wider band gap than the first semiconductor layer; a third semiconductor layer formed on a surface of the second semiconductor layer, having a narrower band gap than the second semiconductor layer, and composed of a nitride semiconductor containing indium; a first electrode being in contact with the third semiconductor layer and formed so as to be in Schottky contact with the second semiconductor layer; and a second electrode formed so as to be in ohmic contact with the second semiconductor layer. The third semiconductor layer extends from the first electrode side to the second electrode side, and the third semiconductor layer exists between an end portion of the first electrode on the second electrode side and the second semiconductor layer.
申请公布号 JP2014157993(A) 申请公布日期 2014.08.28
申请号 JP20130029325 申请日期 2013.02.18
申请人 FURUKAWA ELECTRIC CO LTD:THE;FUJI ELECTRIC CO LTD 发明人 KUMADA TAKAO
分类号 H01L29/812;H01L21/28;H01L21/338;H01L29/06;H01L29/41;H01L29/423;H01L29/47;H01L29/778;H01L29/872 主分类号 H01L29/812
代理机构 代理人
主权项
地址