发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an art in a semiconductor device, which is capable of reducing man hour required for an attach/detach work of a fastening jig when bonding a base plate and a case by an adhesive, and capable of securing the base plate and the case with high fastening power. ! SOLUTION: A semiconductor device comprises: a base plate 1 on which an attachment part having a screw part 1b is formed and a semiconductor element is arranged; a bush 3 capable of being screwed with the attachment part of the base plate 1; and a case 2 in which an insertion hole 2b capable of inserting the bush 3 is formed. Further in the semiconductor device, by screwing the bush 3 to the attachment part of the base plate 1 in a state where the case 2 is placed on the base plate 1, the base plate 1 and the case 2 are secured. ! COPYRIGHT: (C)2014,JPO&INPIT
申请公布号 JP2014157954(A) 申请公布日期 2014.08.28
申请号 JP20130028525 申请日期 2013.02.18
申请人 MITSUBISHI ELECTRIC CORP 发明人 INOUE SHINGO ; KUWABARA TAIYO
分类号 H01L23/40 主分类号 H01L23/40
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