ONE COMPONENT, DUAL-CURE ADHESIVE FOR USE IN ELECTRONICS

摘要

The disclosure relates to one-component, dual-cure adhesive compositions that include a combination of moisture curable functionalities and radiation curable functionalities where the adhesive could include (1) a moisture-curable prepolymer and a radiation-curable component; or (2) a moisture curable radiation curable prepolymer including moisture curable functionalities and radiation curable functionalities, and optionally an additional moisture-curable prepolymer and/or an additional radiation-curable component. The disclosed adhesives can be used on substrates with electronic components to make electronic assemblies.

主权项

1. A method of making an electronic assembly comprising:
(A) applying an adhesive composition to at least a portion of a first substrate, the adhesive composition comprising a moisture curable radiation curable prepolymer having a moisture curable functionality and radiation curable functionality; and (B) contacting the adhesive on the first substrate with at least a portion of a second substrate, at least one of the first and second substrates comprising at least one electronic component prior to applying the adhesive.