HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

A method of manufacturing a heat dissipating device includes steps of providing a base, wherein the base includes a clamping portion, a supporting portion and two side portions, the clamping portion is arc-shaped, a first recess structure is formed on an outer surface toward an inner surface of each side portion, the two side portions connect the clamping portion and the supporting portion, and an accommodating space is formed between the clamping portion, the supporting portion and the two side portions; disposing a first end of a heat pipe in the accommodating space, wherein the first end is supported on the supporting portion; and punching the clamping portion toward the supporting portion such that the clamping portion cooperates with the supporting portion to clamp the first end in a tight-fitting manner, wherein the clamping portion is capable of deforming through the first recess structure during punch processing.

主权项

1. A heat dissipating device comprising:
a base comprising a clamping portion, a supporting portion and two side portions, a first recess structure being formed on an outer surface toward an inner surface of each side portion, the clamping portion being opposite to the supporting portion, the two side portions connecting the clamping portion and the supporting portion, an accommodating space being formed between the clamping portion, the supporting portion and the two side portions; and a heat pipe, a first end of the heat pipe being disposed in the accommodating space and supported on the supporting portion, the clamping portion cooperating with the supporting portion to clamp the first end of the heat pipe in a tight-fitting manner.